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0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole straight pin header, 2x18, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip SMD 1x13 2.00mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x23, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted socket strip THT 2x39 1.27mm double row Through hole angled pin header THT 2x11 2.54mm double row Through hole angled pin header THT 2x27 2.54mm double row Through.

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