Labels Milestones
BackBody [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide 16-Lead Plastic Small Outline (ST)-4.4 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 22-pin zero insertion force socket, through-hole, row spacing 5.08 mm (200 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST Slide 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL ZIF 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 20 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 18 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 18-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-104-02-xxx-DV-BE-LC, 4 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-30DS-0.5V, 30 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000992393), generated with kicad-footprint-generator ipc_noLead_generator.py DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad.
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