3
1
Back

- 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad with vias HTSSOP, 20 Pin (http://www.ti.com/lit/ml/mpqf239/mpqf239.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0710, with PCB locator, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 2, Wuerth electronics 9774010943 (https://katalog.we-online.de/em/datasheet/9774010943.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xxx-DV, 43 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x.

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