3
1
Back

4.0x4.0x0.8 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic DFN (5mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; No exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin without exposed pad 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 34 pins, dual row male, vertical entry Harwin LTek Connector, 44 pins, single row Through hole angled socket strip THT 2x30 1.00mm double row Through hole angled socket strip, 1x29, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad.

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