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I, 28 pins, through hole M3, height 3, Wuerth electronics 9771090360 (https://katalog.we-online.com/em/datasheet/9771090360.pdf), generated with kicad-footprint-generator connector Molex Mini-Fit_Jr side entry Molex Pico-EZmate series connector, B8P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator TE, 2-826576-0, 20 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 10x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads THT DIP DIL PDIP 2.54mm 24.13mm 950mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x19.34mm 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 22.86 mm (900 mils), Socket THT DIP DIL ZIF 25.4mm 1000mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 32-pin zero insertion force socket, through-hole, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf.

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