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Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300.

• Shielded Inductor SMD 3x3x1mm.
• | 46 ..._Vertical_CircularHoles_centered.kicad_mod | 44 ...ter_Alps_RK163_Single_Horizontal.kicad_mod.
• -1.19444 5.69312 21.335 facet normal.
• Series, Taiyo-Yuden_NR-30xx, 3.0mmx3.0mm Inductor, Wuerth Elektronik, Wuerth_HCI-1050.

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