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Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, 0.8875x1.3875mm, 5 Ball, 2x3.

• -6.417228e+000 1.747200e+001 facet normal 1.331864e-01 -3.643072e-03.
• -0.32036 -0.220665 0.921236 facet normal -0.164775.
• -2.663729e+000 9.983999e+000 vertex 3.614395e+000 -4.406236e+000 2.496000e+001.
• 0.99321 facet normal 0.64416.

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