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BackMac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes unplated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file View File 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_End_Male.stl Executable file View File 3D Printing/Pot_Knobs/pot_knob-6mm-clear.stl Executable file View File Hardware/Panel/precadsr_panel.svg Normal file Unescape Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Panel_Dual_Slotted_Mounting_Hole.kicad_mod Normal file Unescape Mon 19 Apr 2021 12:09:41 PM EDT Thu 22 Apr 2021 10:22:18 AM EDT Mon 10 May 2021 12:33:34 AM EDT
- -0.643675 0.528237 0.553758 facet normal -0.956902.
- Connector, 501331-0307 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator.