Labels Milestones
BackSOIC, 28 Pin (http://www.ti.com/lit/ds/symlink/tps51363.pdf#page=29), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 10-Lead Plastic Dual Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad 3x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled socket strip, 2x03, 2.00mm pitch, 4.2mm pin length, single row style2 pin1 right Through hole angled pin header, 2x19, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header THT 2x04 2.54mm double row Through hole angled socket strip, 1x14, 1.00mm pitch, double.