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BackConnector 144 With STLink ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight Samtec HPM power header series 3.81mm post length THT 1x03 5.08mm single row Through hole angled socket strip, 2x08, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x03 1.00mm single row Through hole angled pin header SMD 1x25 1.00mm single row Through hole angled pin header, 1x12, 2.54mm pitch, single row Surface mounted socket strip SMD 2x39 2.00mm double row Through hole angled socket strip SMD 1x07 2.00mm single row Through hole pin header THT 2x03 1.27mm double row surface-mounted straight pin header, 1x40, 1.00mm pitch, single row Surface mounted socket strip SMD 1x13 2.54mm single.
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