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Resistor, MicroMELF, MMU-0102, http://www.vishay.com/docs/28713/melfprof.pdf Resistor, MiniMELF, MMA-0204, http://www.vishay.com/docs/28713/melfprof.pdf 4 contact shunt resistor 4 contacts resistor smd 4 contacts resistor smd 4 contacts shunt resistor,https://www.ohmite.com/assets/docs/res_lvk.pdf Shunt Resistor SMD 01005 (0402 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: https://www.vishay.com/docs/30100/wsl.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0018 example for new part number: A-41792-0004 example for new part number: AE-6410-04A example for new mpn: 39-29-4109, 5 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BB), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 4 Pin (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/0_Datasheets/Humidity/Sensirion_Humidity_Sensors_SHTC3_Datasheet.pdf Sensirion DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [HTSSOP], with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502443-0770 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with.

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