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2x02, 1.00mm pitch, double rows Through hole IDC header, 2x30, 1.00mm pitch, 2.0mm pin length, double rows Through hole socket strip SMD 2x26 2.54mm double row Through hole angled pin header, 2x27, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x33, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header THT 2x40 2.00mm double row SMD IDC box header THT 2x30 2.54mm double row surface-mounted straight pin header, 1x17, 2.00mm pitch, single row Through hole Samtec HPM power header series 11.94mm post length THT 1x16 1.00mm single row Surface mounted pin header THT 2x13 1.27mm double row Through hole IDC header, 2x05, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x37 2.54mm double row surface-mounted straight socket strip, 1x33, 2.54mm pitch, double rows Through hole straight pin header, 2x08, 2.54mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x11, 1.00mm pitch, double rows Through hole pin header THT 2x03 1.27mm double row Through hole angled pin header, 1x13, 2.00mm pitch, 4.2mm pin length, double rows Through hole pin header THT 2x04 2.54mm double row Through hole straight socket strip, 2x21, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted socket strip THT 1x40 2.00mm single row Through hole angled pin header, 2x25, 2.54mm pitch, single row Through hole angled socket strip SMD 1x06 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x10 2.54mm single row style1 pin1 left Surface mounted socket strip SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, bridged with 2 pads, pad diameter 3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Zynq-7000 BGA.

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