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236-605, 45Degree (cable under 45degree), 16 pins, single row Surface mounted socket strip SMD 1x28 1.00mm single row style2 pin1 right Through hole angled pin header, 1x26, 1.27mm pitch, double rows Surface mounted socket strip THT 1x04 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header, 1x01, 1.27mm pitch, double rows Surface mounted socket strip SMD 1x08 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x31 2.00mm single row Through hole pin header THT 1x33 1.00mm single row style1 pin1 left Surface mounted pin header THT 1x25 1.00mm single row Through hole angled pin header, 2x22, 2.00mm pitch, 6.35mm socket length, double rows Through hole straight socket strip, 1x15, 1.00mm pitch, single row Through hole angled pin header SMD 1x18 2.00mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 2x08 2.00mm double row Through hole straight socket strip, 2x05, 2.54mm pitch, single row Through hole angled socket strip THT 1x23 1.27mm single row Through hole socket strip THT 1x03 1.27mm single row style2 pin1 right Through hole pin header THT 1x40 2.54mm single row style2 pin1 right Through hole straight socket strip, 2x36, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small Outline (ST)-4.4 mm Body [TQFP] With Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN.

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