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0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), https://wiki.wemos.cc/products:d1:d1_mini, https://c1.staticflickr.com/1/734/31400410271_f278b087db_z.jpg DIN rail adapter universal three M3 clearance holes Mounting Hole 2.2mm, no annular, M3, ISO14580 mounting hole 2.7mm m2.5 iso7380 Mounting Hole 2.2mm, M2, ISO14580 mounting hole 6.5mm no annular m4 Mounting Hole 3.2mm, M3, DIN965 mounting hole 4.3mm no annular Mounting Hole 2.7mm, M2.5, ISO7380 mounting hole 5.3mm m5 Mounting Hole 3.2mm, no annular, M6, DIN965 mounting hole 6.4mm m6 Mounting Hole 4.3mm, M4, ISO14580 mounting hole 5.3mm no annular m3 iso7380 Mounting Hole 6.4mm, M6, DIN965 mounting hole 6.4mm no annular mounting hole 6mm no annular m4 iso14580 Mounting Hole 2.7mm, M2.5, ISO7380 mounting hole 2.7mm m2.5 iso14580 Mounting.

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