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676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight pin header, 1x20, 2.54mm pitch, double rows Surface mounted pin header SMD 1x08 1.27mm single row Through hole straight socket strip, 2x14, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x16 2.54mm double row Through hole horizontal IDC header THT 1x15 1.27mm single row Surface mounted socket strip SMD 1x37 2.54mm single row Surface mounted socket strip SMD 1x36 2.00mm single row style2 pin1 right Through hole straight socket strip, 2x35, 2.54mm pitch, double rows Surface mounted socket strip THT 1x26 2.54mm single row style2 pin1 right Through hole straight pin header, 2x13, 2.54mm pitch, DIN.

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