Labels Milestones
BackDE Package; 14-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41791-0013 example for new part number: 09-65-2128.
- Connector, 50 pins, dual row male.
- -0.489712 -0.50788 0.708689 vertex -4.60319 -5.70811 7.20554 facet.