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Socket 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF.

• 0.0979878 -0.988483 0.115323 facet normal.
• 483 lines From d12ec1f19bbae8f01395e4c76a152d3d4ce7a3d4.
• Normal -0.243779 0.297045 0.92322.
• Do partial planes where convenient.
• Normal 3.987226e-16 -7.910530e-01 6.117476e-01 facet normal.

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