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Type B, Vertical, 2 rows 10 pins wide, https://www.erni-x-press.com/de/downloads/kataloge/englische_kataloge/erni-din41612-iec60603-2-e.pdf DIN41612 connector, type B, horizontal version, through-hole, https://downloads.lumberg.com/datenblaetter/en/2411_02.pdf USB B receptable with flange, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118193.pdf USB Micro-B receptacle, through-hole, vertical, http://katalog.we-online.de/em/datasheet/614105150721.pdf usb micro receptacle vertical Mini USB 2.0 Type C Receptacle, GCT, power-only, 6P, top mounted, horizontal, 3A: https://gct.co/files/drawings/usb4135.pdf USB C Type-C Receptacle Hybrid CNCTech C-ARA1-AK51X USB Type B SMT Horizontal 5 Contacts (https://katalog.we-online.de/em/datasheet/65100516121.pdf Mini USB 2.0 USB TYPE C, RA RCPT PCB, SMT, https://gct.co/files/drawings/usb4115.pdf USB Type-C Plug Edge Mount Universal Serial Bus (USB) Shielded I/O Plug, Type C, right-angle, SMT, https://datasheet.lcsc.com/lcsc/2206091745_XKB-Connectivity-U254-051T-4BH83-F1S_C397452.pdf USB Micro-B receptacle, through-hole, vertical, http://katalog.we-online.de/em/datasheet/614105150721.pdf usb micro receptacle vertical USB 2.0 Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices (Linear Tech), 133-pin LGA uModule, 15.0x15.0x4.32mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf NXP LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic DFN (6mm x 5mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27 FBGA-96, 14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Shrink Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas QFN, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf), generated with kicad-footprint-generator Samtec.

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