3
1
Back

Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x32.04mm 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 7.62 mm (300.

New Pull Request