Labels Milestones
BackPackage (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead.
- 0.5 mm pitch, ultra thin.
- -8.143624e-05 7.234498e-01 vertex -1.088945e+02 9.695134e+01 5.816114e+00 vertex.