Labels Milestones
BackBGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package.
New Pull RequestBGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package.
New Pull Request