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HTSSOP56: plastic thin shrink small outline package; 10 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300.

• -0.630636 -0.768498 0.108209 vertex 5.20733.
• -0.442581 -0.106258 0.890411 facet normal -0.831468 -0.555573 -2.91184e-08.
• 1843868 8A 160V Generic Phoenix.
• For voltage clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf SOIC, 14 Pin.

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