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BackLinear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Dual Flat, No Lead Package - 4x4x0.9 mm Body [HTSSOP], with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1821 (alternative finishes: 43045-240x), 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PH series connector, B2P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S2P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST GH series connector, B03B-JWPF-SK-R (http://www.jst-mfg.com/product/pdf/eng/eJWPF1.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 5, Wuerth electronics barrel jack connector (5.5mm outher diameter, inner diameter ), https://gct.co/files/drawings/dcj200-10.pdf DC Power Jack, 13A, 24V, Panel Mount,Through-hole, https://www.switchcraft.com/Drawings/RAPC10U_CD.pdf barreljack switchcraftconxall dc power Wuerth electronics 97730406330 (https://katalog.we-online.com/em/datasheet/97730406330.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP28: plastic thin shrink small outline package; 56 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 24 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin.
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