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LongPads 28-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 7.62 mm (300 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm.

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