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C5, 6.3x4.9mm SMD capacitor, aluminum electrolytic, Panasonic E7, 8.0x6.9mm SMD capacitor, aluminum electrolytic, United Chemi-Con, 6.3x5.2mm SMD capacitor, aluminum electrolytic, Panasonic E7, 8.0x6.9mm SMD capacitor, aluminum electrolytic, Nichicon, 8.0x10mm SMD capacitor, aluminum electrolytic, Vishay 1014, 10.0x14.3mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic, Nichicon, 5.0x3.0mm SMD capacitor, aluminum electrolytic, Panasonic C6, 6.3x5.9mm SMD capacitor, aluminum electrolytic nonpolar, 4.0x5.4mm SMD capacitor, aluminum electrolytic, Vishay 1621, 16.0x22.0mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic, Nichicon, 8.0x5.4mm SMD capacitor, aluminum electrolytic, Nichicon, 8.0x5.4mm SMD capacitor, aluminum electrolytic, Panasonic C10, 6.3x9.9mm SMD capacitor, aluminum electrolytic nonpolar, 4.0x5.8mm SMD capacitor, aluminum electrolytic, Panasonic F12, 10.0x12.6mm SMD capacitor, aluminum electrolytic, Nichicon, 5.0x3.0mm SMD capacitor, aluminum electrolytic, Vishay 1010, 10.0x10.5mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic, Nichicon, 6.3x3.0mm SMD capacitor, aluminum electrolytic, Panasonic C5, 6.3x4.9mm SMD capacitor, aluminum electrolytic nonpolar, 4.0x5.4mm SMD capacitor, aluminum electrolytic, Panasonic C5, 6.3x4.9mm SMD capacitor, aluminum electrolytic, Vishay 1014, 10.0x14.3mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic, Vishay 1821, 18.0x22.0mm, http://www.vishay.com/docs/28395/150crz.pdf Capacitor SMD Kemet-W (7343-15 Metric), IPC_7351 nominal, (Body size source: https://www.susumu.co.jp/common/pdf/n_catalog_partition07_en.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Small Outline (SM) - 5.28 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332), generated with kicad-footprint-generator Samtec HLE .100" Tiger.

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