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MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf DFN package size 0604 3 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 9.0mm 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 2.0mm 2 pins LED_Rectangular.

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