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BackBody (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf TSOP-I, 56 Pin top tented version (manually modified). For information see: http://www.cypress.com/file/138911/download QFN, 56 Pin (JEDEC MS-013AB, https://www.analog.com/media/en/package-pcb-resources/package/33254132129439rw_18.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 7, Wuerth electronics 9774080243 (https://katalog.we-online.de/em/datasheet/9774080243.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/39935c.pdf#page=152), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 56 Pin (http://www.ti.com/lit/ds/symlink/tlc5957.pdf#page=23), generated with kicad-footprint-generator ipc_noLead_generator.py mlf 8 2x2 mm 16-Lead Quad Flat, No Lead Package - 4x4x0.9 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 10-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62.
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