3
1
Back

Package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 20 leads; body width 4.4 mm; thermal pad LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT617-1.pdf), generated with kicad-footprint-generator connector Hirose.

New Pull Request