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Thru-hole 18 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch Vertical 215079-4 7-215079-4 TE-Connectivity Micro-MaTch Vertical 1-215079-4 8-215079-14 TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 18 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 8 pin SIM connector for 2.4mm PCB's with 70 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 08 contacts (polarized Highspeed card edge connector for PCB's with 05 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 70 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf WLCSP-90, 10x9 raster, 4.223x3.969mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip THT 2x37 2.54mm double row surface-mounted straight pin header, 2x21, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x25 1.27mm single row Through hole socket strip THT 1x24 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x27, 2.00mm pitch, double rows Surface mounted pin header THT 2x39 2.00mm double row Through hole straight socket strip, 2x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled socket strip SMD 2x34 2.00mm double row Through hole straight pin header, 2x19, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header SMD 2x07 2.54mm double row Through hole angled socket strip SMD 1x04 2.54mm single row Through hole angled socket strip, 2x20, 2.54mm pitch, double rows Through hole angled socket strip SMD 1x28 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x11 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 1x09 2.54mm single.

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