Labels Milestones
BackPitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 1x04 2.54mm single row Through hole straight pin header, 2x27, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x04, 1.00mm pitch, double rows Through hole straight socket strip, 2x26, 1.27mm pitch.
- HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20.
- Software due to referer checks) Invisible Bread.