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LQFP, 36 Pin (http://www.ti.com/lit/ds/slvsba5d/slvsba5d.pdf#page=35), generated with kicad-footprint-generator XP_POWER IAxxxxD DIP DCDC-Converter XP_POWER IHxxxxS, SIP, (https://www.xppower.com/pdfs/SF_IH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-150-02-xxx-DV-BE, 50 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SS)-5.30 mm Body [UDFN] (see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2951-n.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://www.st.com/resource/en/datasheet/lm2903.pdf#page=16), generated with kicad-footprint-generator ipc_noLead_generator.py Micro Leadframe Package, 16 pin with exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin with exposed pad 8-Lead Plastic DFN (6mm x 5mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 28 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (https://www.diodes.com/assets/Datasheets/PAM8403.pdf.

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