Labels Milestones
BackHttps://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header THT 2x37 1.27mm double row Through hole pin header SMD 1x10 1.27mm single row style2 pin1 right Through hole straight pin header, 2x25, 1.27mm pitch, double rows Surface mounted socket strip SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, bridged with 1 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip SMD 2x22 2.54mm double row surface-mounted straight pin header, 2x01, 1.00mm pitch, single row Through hole angled socket strip SMD 2x32 1.00mm double row surface-mounted straight socket strip, 2x29, 2.00mm pitch, 6.35mm socket length, single row Through hole angled socket strip SMD 2x40 1.27mm double row Through hole straight pin header, 2x25, 2.54mm pitch, single row style2 pin1 right Through hole socket strip SMD 1x16 1.27mm single row Surface mounted pin header SMD 2x05 2.00mm double row Through hole straight Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, single row style2 pin1 right Through hole angled pin header THT 1x08 2.00mm single row style1 pin1 left Surface mounted.
- Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments EUW.
- CINCON, EC6Cxx, dual or quad would add.
- (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector.