Labels Milestones
BackDSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZR pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.8mm Altera BGA-68 M68 MBGA.
- Connector, B3P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf.
- 4.99768 -5.42659 6.90571 facet normal.
- -9.09213 3.43962 3.26879 vertex -8.28463 5.53561.
- 7.87301 3.54602 vertex 5.4146 8.10352 3.26879 facet normal.