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[TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 20 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 32 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/6957fb.pdf#page=36), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-30DS-0.5V, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_dfn_qfn_generator.py QFN, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_17.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B15B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://www.ti.com/lit/ds/symlink/bq24006.pdf), generated with kicad-footprint-generator connector wire 0.75sqmm strain-relief Soldered wire connection with feed through strain relief, for 6 times 0.15 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xx-DV-PE-LC, 37 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0304.

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