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Type011_RT05503HBWC pitch 5mm size 45x9mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-124, 45Degree (cable under 45degree), 2 pins, diameter 5.0mm z-position of LED center 3.0mm, 3 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-169XCGDK(Ver.9B).pdf LED_Rectangular Rectangular Rectangular size 5.0x2.0mm^2, 3 pins, pitch 5mm, size 60x8.1mm^2, drill diamater 1.1mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00046 pitch 5mm size 42.3x14mm^2 drill 1.15mm pad 3mm Terminal Block 4Ucon ItemNo. 10689, 12 pins, single row style1 pin1 left Surface mounted socket strip THT 2x35 2.54mm double row Through hole angled socket strip, 2x35, 2.54mm pitch, https://www.raspberrypi.org/documentation/hardware/raspberrypi/mechanical/rpi_MECH_Zero_1p2.pdf raspberry pi zero through hole M3, height 15, Wuerth electronics 9774040360 (https://katalog.we-online.de/em/datasheet/9774040360.pdf), generated with kicad-footprint-generator Molex Pico-EZmate series connector, 53780-0770 (), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-20DS-0.5V, 20 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 8, Wuerth electronics 9774020960 (https://katalog.we-online.de/em/datasheet/9774020960.pdf,), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2106, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ Infineon SO package 20pin with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Quad Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [TQFP] With Exposed Pad Variation BB; (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic PSOP.

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