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Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11.

• 155.1 149.37 (end 155.706823 109.135 (end 156.755141.
• 1 FB900 FBG900 FBV900 Kintex-7.
• -0.0363869 0.0926168 0.995037 facet normal -0.172963.
• 5.309830e+000 -2.071118e+000 2.495526e+001 facet normal 0.957368 0.115024 0.264982.

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