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YFF0006, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole IDC header, 2x12, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header, 2x02, 2.00mm pitch, double rows Surface mounted socket strip SMD 1x36 2.54mm single row Surface mounted pin header THT 2x11 2.00mm double row Through hole angled pin header, 2x09, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x24 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x11 1.00mm double row surface-mounted straight socket strip, 2x09.

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