3
1
Back

KBPC_T(FP), https://www.digitroncorp.com/Digitron/media/Files/Datasheets/KBPC15005-SERIES.pdf Single phase, Bridge Rectifier, 28.55x28.55mm, case KBPC_T(FP), https://www.digitroncorp.com/Digitron/media/Files/Datasheets/KBPC15005-SERIES.pdf Single phase, Bridge Rectifier, 28.55x28.55mm, case KBPC_W(WP), https://www.diodemodule.com/bridge-rectifier/kbpc/kbpc15005w.pdf 128x32 LCD with RGB backlight https://www.newhavendisplay.com/specs/NHD-C12832A1Z-FSRGB-FBW-3V.pdf EPCOS/TDK Electronics/Qualcomm DCC6c SAW filter package, https://www.golledge.com/media/3785/mp08167.pdf 8-pin 3.8x3.8mm SAW filter, https://www.golledge.com/media/1831/ma05497.pdf Compact PCB mounting EMI filter (https://www.schaffner.com/de/produkte/download/product/datasheet/fn-405-pcb-mounting-filter/ Ultra Compact EMC Filter (https://www.schaffner.com/products/download/product/datasheet/fn-406-ultra-compact-emc-filter/ Fuse SMD 2920 (7451 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 4 times 2 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 14, Wuerth electronics 9774030482 (https://katalog.we-online.de/em/datasheet/9774030482.pdf), generated with kicad-footprint-generator JST XH series connector, S12B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-9)), generated with kicad-footprint-generator JST J2100 series connector, S08B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (SO) - Wide, 5.3 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (https://www.ti.com/lit/pdf/qfnd619), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-17S-0.5SH, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1110, with.

New Pull Request