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Broadcom LGA, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.1 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-02A2, example for new mpn: 39-28-908x, 4 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770190-x, 5 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with.

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