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Inductor, 3.0x2.8x2.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-1004 unshielded SMD power inductor, CWR1242C, H=4.5mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf inductor sagami cwr12xx smd Sagami power inductor, 3.0x2.8x2.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-0504 unshielded SMD power inductor, 4.5x4.0x3.2mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-1005 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5339, https://www.onsemi.com/pub/Collateral/457-04.PDF QFN, diode, 3.3x3.3x1mm (https://www.wolfspeed.com/media/downloads/846/C3D1P7060Q.pdf Diode, Universal, SMC (DO-214AB), RM10, Handsoldering, SMD, Thruhole Diode Universal MELF RM10 Handsoldering SMD Thruhole Diode SMC (DO-214AB) Handsoldering Diode SMA (DO-214AC) or SMB (DO-214AA), Handsoldering, Diode Universal MELF RM10 Handsoldering SMD Thruhole Diode, MicroMELF, Reflow Soldering, http://www.vishay.com/docs/85597/bzm55.pdf Diode, MicroMELF, Reflow Soldering, http://www.vishay.com/docs/85597/bzm55.pdf Diode Mini-MELF (SOD-80) Handsoldering Microsemi Powermite SMD power inductor, CWR1242C, H=7.7mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf SMD Power Inductor (http://products.sumida.com/products/pdf/CDMC6D28.pdf Inductor Sumida SMD CDMC6D28 Inductor, Sumida, 8.1mm × 7.3mm × 5.5 mm, Unshielded, http://products.sumida.com/products/pdf/CR75.pdf Inductor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-11P-1.25DSA, 11 Pins per row, Mounting: PCB Mounting Flange (http://www.molex.com/pdm_docs/sd/039291047_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 5, Wuerth electronics 9776070960 (https://katalog.we-online.com/em/datasheet/9776070960.pdf), generated with kicad-footprint-generator JST SUR series connector, DF3EA-02P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 2.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST XH series connector, BM03B-AUHKS-GA-TB (http://www.jst-mfg.com/product/pdf/eng/eAUH.pdf), generated with kicad-footprint-generator Inductor SMD 1008 (2520 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.susumu.co.jp/common/pdf/n_catalog_partition07_en.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-770621-x, 6 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator JST PH series connector, B12B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2103, With thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix.

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