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9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 5.9 mm (232 mils), body size 10.8x16.8mm 6x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 5.08mm 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-118-02-xxx-DV-A, 18 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator JST XH series connector, S28B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0407-6-51, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST EH series connector, LY20-8P-DT1, 4 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Inductor SMD 1806 (4516 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 1-794105-x, 9 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 20 Pin (JEDEC MO-153 Var JB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST ZE series connector, B03B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST EH series connector, B7PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator JST JWPF series connector, SM10B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM06B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-5130, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for.

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