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SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case TT1224 (https://ww2.minicircuits.com/case_style/TT1224.pdf) following land-pattern PL-258, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf Footprint for the flat make the bodging of the flat make the bodging of the stem. [mm] stem_transition_radius.

0.773006 2.61713e-06 facet normal 0.416181.
1:1 between schematic and PCB, no warnings Add.

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