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File # Temporary files *.lck # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5.

0.980786 -0.195086 1.65233e-07 vertex -3.42107 0.0197401 18.1498 facet.
5.00013 3.82299 facet normal 0.2956 0.346101 0.890413.
2.53508 1.69389 6.59 vertex -1.32743 -3.1531 18.1498 facet.
Href="https://gitea.circuitlocution.com/synth_mages/MK_VCO/commit/6f5ee76aea5e7cdfb79e86a703d20d48842d1955">6f5ee76aea5e7cdfb79e86a703d20d48842d1955 adds front panel.
Before producing, confirm footprint dimensions for capacitors.

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