Labels Milestones
Back1.00 SSOP14: plastic shrink small outline package; 48 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 2mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf LFCSP, 48 Pin (http://www.thatcorp.com/datashts/THAT_626x_Datasheet.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 6, Wuerth electronics 9774040482 (https://katalog.we-online.de/em/datasheet/9774040482.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 10, Wuerth electronics 9774025243 (https://katalog.we-online.de/em/datasheet/9774025243.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm.
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