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WLCSP-25, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x15, 2.54mm pitch, 8.51mm socket length, single row style1 pin1 left Surface mounted socket strip THT 2x07 2.54mm double row Through hole socket strip THT 2x11 2.54mm double row Through hole straight pin header, 2x14, 1.00mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x36, 2.00mm pitch, 6.35mm socket length, single row Surface mounted socket strip SMD 1x06 1.27mm single row Through hole pin header SMD 1x08 2.54mm single.

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