Labels Milestones
BackFBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header THT 2x24 1.00mm double row Through hole IDC header, 2x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x38, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x35 1.00mm single row Through hole straight socket strip, 2x15, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted socket strip SMD 1x36 2.54mm single row Through hole angled pin header, 2x11, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x25, 2.54mm pitch, single row Surface mounted.
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