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E.g. Ettinger 13.13.890, https://katalog.ettinger.de/#p=434 Through hole pin header THT 1x16 2.54mm single row Surface mounted socket strip SMD 2x35 1.27mm double row surface-mounted straight pin header, 2x30, 2.54mm pitch, single row style2 pin1 right Through hole straight pin header, 1x01, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 2x34 2.54mm double row surface-mounted straight socket strip, 1x18, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole angled socket strip, 2x18, 1.00mm pitch, single row style2 pin1 right Through hole pin header THT 1x35 2.00mm single row Through hole angled pin header THT 1x33 2.00mm single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x43 1.27mm double row Through hole straight socket strip, 2x23, 2.00mm pitch, double rows Surface mounted socket strip SMD 2x28 1.00mm double row surface-mounted straight pin header, 2x05, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight socket strip, 1x30, 2.00mm pitch, double rows Through hole socket strip THT 2x37 1.27mm double row Through hole pin header THT 2x24 2.54mm double row Through hole angled pin header THT 2x24 2.54mm double row Through hole angled socket strip THT 2x39 1.27mm double row surface-mounted straight pin header, 2x23, 1.27mm pitch, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias in pads, 6 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator XP_POWER IHxxxxD DIP DCDC-Converter XP_POWER IAxxxxS, SIP, (https://www.xppower.com/pdfs/SF_IA.pdf), generated with kicad-footprint-generator JST GH series connector, LY20-6P-DLT1, 3 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP120 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 506BU.PDF 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0530, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-R (7260-15 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator.

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