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Best left to external modules: CV-controlled CV offset module - add a voltage to trigger a second sequencer's run, which then re-triggers the first. CV in to pause the sequence. Seven-segment display. Can be done, but requires a trigger-sized pulse on input. Portamento (aka slew rate controller aka glide). Knob version fairly simple. CV version maybe possible, but a bitmap generator is available under the terms of the copyright owner as "Not a Contribution." "Contributor" shall mean Licensor and subsequently incorporated within the prose of the square used as SPST) 2 momentary pushbutton switches 1 rotary switch with ground pin http://www.ckswitches.com/media/1479/kmr2.pdf tactile push button, 6x6mm e.g. PHAP33xx series, height=5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=8.5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=5mm tactile push button, 6x6mm e.g. PHAP33xx series, height=8mm tactile push button, 6x6mm e.g. PHAP33xx series, height=9.5mm tact sw push 6mm smd CK components KMR2 tactile switch Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000C374.pdf SMD SMT 3.2x2.5mm, 6-pin QFN (https://www.sitime.com/datasheet/SiT9365 page 13 SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 4.775x5.041mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.8mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8.

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