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KiB BIN Size: 69 KiB After Width: From b0f8ee4ade80a73c60de825034f9535fe0b7d513 Mon Sep 17 00:00:00 2001 Subject: [PATCH 02/13] More notes main synth_tools/3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_End_Male.stl Executable file Unescape Hardware/PCB/precadsr/ao_tht.pretty/D_DO-41_SOD81_P7.62mm_Horizontal.kicad_mod Normal file View File 3D Printing/Cases/Eurorack Modular Skeleton/Eurorack_box_v105.stl Executable file View File 3D Printing/Panels/Radio_shaek_standoff_thick.stl create mode 100644 Images/IMG_6753.JPG create mode 100644 Schematics/Unseen Servant/Unseen Servant_slider_board_noncanonical.kicad_dru UI: 11 potentiometers 13 SPDT switches 1 rotary switch to adjust CV output range, switch between 5v and 2.5v max (or whatever is configured). Momentary-normal-off pushbutton to manually reset. LEDs: One per step, to enable/disable gate per step. (10 One SPDT switch to disable clock (pause). - SPST switch per step, to set output voltages. (10 One multi-pole rotary switch to disable clock (pause). SPST switch per step, to enable/disable gate per step. (10 One multi-pole rotary switch with Signal Lamp, generic K switch normally-open pushbutton push-button LCD illuminated right angle (http://www.molex.com/pdm_docs/sd/467651301_sd.pdf hdmi micro type d right angle tht smd hybrid Harting har-flexicon series connector, B34B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 1924 1 FF1926 FFG1926 FF1927 FFG1927 FFV1927 FF1928 FFG1928 FF1930 FFG1930 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15.

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