3
1
Back

ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, off-center ball grid, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole straight socket strip, 2x13, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x10 2.00mm single row Through hole straight socket strip, 2x21, 2.00mm pitch, 4.2mm pin length, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x16 1.27mm single row style1 pin1 left Surface mounted pin header SMD 2x34 1.00mm double row Through hole angled socket strip, 1x23, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x37, 2.54mm pitch, 6mm pin length, single row style2 pin1 right Through hole socket strip SMD 1x05 1.27mm single row Surface mounted pin header THT 1x03 1.00mm single row Through hole socket.

New Pull Request